Applications > Semiconductor > Advanced Semiconductor Packaging & Assembly (ASPA)
Advanced Semiconductor Packaging & Assembly (ASPA)
High reliability and yield in the manufacturing of advanced integrated circuits can be difficult to achieve as package sizes decrease and the use of advanced materials increases.
Many manufacturing challenges can be improved or overcome by using a suitable plasma treatment, including improving die attach, increasing wire bond strength, eliminating flip-chip underfill voids, and reducing package delamination.
March Plasma Systems manufactures manual, batch and automated plasma treatment systems specifically designed for the advanced semiconductor packaging & assembly (ASPA) industry. March’s plasma systems are designed to provide highly repeatable results with excellent etch rates (where required) and treatment uniformity. Our systems are also capable of handling multiple part sizes and very high-throughput production requirements.
Related Technical Papers:
Related Products:
AP-1000 Plasma Treatment System
PLC controller with touch screen interface provides industrial reliability and ease of use. Complete system enclosure minimizes footprint.
FlexTRAK™ Plasma Treatment System
The FlexTRAK system offers high-throughput capability of up to 480 substrates or process carriers per hour. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.
FlexTRAK-BH™ Plasma Treatment System
The FlexTRAK-BH system is designed for
high-throughput processing of microelectronic boats, trays, or other
flat device carriers, up to 2 boats per plasma cycle.
FlexTRAK-SH™ Plasma Treatment System
The universal architecture of the FlexTRAK-SH system accommodates a wide range of strip sizes in the same system, yielding unmatched production flexibility.
FlexTRAK-WR™ Plasma Treatment System
The FlexTRAK-WR plasma treatment system is designed for
high-throughput processing of semiconductor wafers up to
300mm
(12 in.).
XTRAK Plasma Treatment System
With process capability of up to 180 substrates or carriers per hour, the system's Smart Tune™ management system provides closed-loop control that reduces tuning to less than one second.
PX-Series Plasma Treatment System
PX-Series systems are equipped with an automatic impedance matching network for ease of operation and consistent results.
CS-1701 Anisotropic RIE Plasma System
The CS-1701 system is excellent for metal etching, silicide etching and etching of III-V compounds, anisotropic etching of nitrides, oxides and polyimides.
PM-100 Plasma Treatment System
Designed to be a low-cost, highly effective plasma treatment solution for treating electronic components, printed circuit boards, and medical & life science devices.
Semiconductor Applications Team
Scott Szymanski, Semiconductor Market Manager
Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A. from the University of Phoenix.
Peter Huang, Semiconductor Applications Engineer
Mr. Huang joined March Plasma Systems in 2006. Prior to his appointment at March he has held a variety of positions in L3 Communications, Raytheon and Texas Instruments. Huang has a BS from Chung Yuan University in Taiwan and a MS from the University of Houston.
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Semiconductor
The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>
Medical Device
The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
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Printed Circuit Board
Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>