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Leading Plasma Innovations

The global leader in gas plasma cleaning technology for Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries. We design and manufacture a complete line of plasma treatment systems, and maintain an expert staff of scientists and engineers trained in plasma science for advanced packaging, life science and PCB technology.

Plasma Cleaning/Contamination Removal

Gas phase plasma, the fourth state of matter, is an electrically neutral mixture of electrons, ions, radicals, and photons created by the application energy such as radio frequency (RF) to a source gas contained within a vacuum chamber.Plasma cleaning is a universally applied environmentally benign process used in numerous manufacturing processes for removal of sub-micron contamination.
Dry processing is advantageous in a wide variety of manufacturing operations for removal of many types of contamination including organic residues, polymer coatings or build-ups, waxes, metals and metal oxides, fluorine and other halogens.
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FlexTRAK-WR Plasma Treatment System

FlexTRAK-WR™ Plasma Treatment System

The FlexTRAK-WR plasma treatment system is designed for
high-throughput descum processing of semiconductor wafers up to
300mm (12 in.).

Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media. More>>>

Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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